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Power infeed hot platens

The power infeed i.e. the optimised heating circuit 1 provides a more homogeneous heating and improves the heat transfer.
Following a design upgrade of heating circuit 1, thermal energy of up to 3 MW can be pumped into the infeed hot platen.

The mat thus heats up much faster and the density profile of the finished board will improve. The system adjusts very quickly to the new requirements of any product change.


  • Improved heating capacity of the infeed section
  • A more homogeneous heat transfer into the product
  • Improved board quality

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